Bisphenol A epoxy vinyl resin

Description of Atlac®430 Vinyl Resin

Atlac®430 is A styrene solution of Epoxy bisphenol A vinyl Resin with moderate reactivity and low viscosity, resistant to a wide range of acid, alkali and bleach corrosive environments in the chemical industry. Atlac®430 vinyl resin is suitable for a wide range of applications under intermittent high temperature conditions with thermal shock due to its excellent heat resistance and elongation.

Atlac®430 vinyl resin application

The resin is suitable for all manufacturing methods, especially for winding, centrifugal casting, hand paste molding and jet molding process applications.

Atlac®430 vinyl resin has excellent resistance to acid and base, heat, bleaching, and mechanical properties so the process has good wettability and fluidity during operation. Atlac®430 can be used in Fiberglass vvreinforced components with excellent chemical resistance for better mechanical properties and good compatibility with carbon fiber and arylon. It can also be used for corrosion resistance engineering of ships, auto parts, containers, storage tanks, water conservancy engineering, sewer pipe repair and so on. Atlac®430 vinyl resin has extremely low viscosity and is suitable for vacuum lead-in, RTM and other processes; It has been certified by China Classification Society CCS and LR by Lloyd's Register of Shipping.

Curing conditions and processes of Atlac®430 vinyl resin

Add 1gButanox LPT and 0.58NL49P to 100g resin and cure at room temperature for 24 hours and at 80℃ for 24 hours. Four layers of 450g/m2 Glass Fiber staple felt.

Atlac®430 vinyl resin is conventionally cured with a non-sticking surface that requires the addition of a suitable additive (e.g., wax) to the resin. The final cured state can be cured at a high temperature for several hours (80-100°C) to achieve the best physical and chemical properties. But it is especially important for curing after use in parts that are resistant to chemical corrosion. MEKP or cyclohexanone Peroxide + cobalt solution curing system with low hydrogen peroxide content is recommended. This cured well, the product surface will not be sticky.

Atlac®430 vinyl resin for use and storage

The resin construction should be carried out under suitable temperature conditions. MEKP/Co curing system is used when the operating temperature is above 15 ℃.

Before use, it should be noted that the resin should be stored in the original packaging in the drying room of 5-30°C, to avoid opening the barrel and the barrel damage situation. Temperature and light exposure will reduce the storage life of styrene containing resins, so it should be stored away from direct sunlight and heat sources, stored in dark and 100% light sealed containers.